Rogers RT/duroid 6035HTC High-Frequency PCB – High Thermal Conductivity for High-Power RF and Microwave Applications
In the last month, we have released a lot of new PCB, let me introduce it to you.
In the world of high-power RF and microwave applications, the choice of PCB material is critical to ensuring optimal performance and reliability. The Rogers RT/duroid 6035HTC High-Frequency PCB is a ceramic-filled PTFE composite designed specifically for high-power applications. With a thermal conductivity nearly 2.4 times that of standard RT/duroid 6000 products, this material offers exceptional thermal management, making it an ideal choice for demanding environments.
1.Key Features of RT/duroid 6035HTC PCB
(1).High Thermal Conductivity (1.44 W/m/K): The RT/duroid 6035HTC material provides excellent heat dissipation, enabling lower operating temperatures for high-power applications. This makes it ideal for circuits that generate significant heat, such as power amplifiers and RF systems.
(2).Low Dielectric Constant (DK 3.5 ±0.05): With a stable dielectric constant, the 6035HTC PCB ensures consistent signal integrity and minimal signal loss, even at high frequencies.
(3).Low Dissipation Factor (0.0013): The low dissipation factor ensures efficient signal transmission, making it suitable for high-frequency applications that require minimal signal loss.
(4).Excellent Thermal Stability: The material’s thermal coefficient of dielectric constant (-66 ppm/°C) ensures stable performance across a wide temperature range, making it reliable in varying thermal conditions.
(5).Low Moisture Absorption (0.06%): The 6035HTC material has low moisture absorption, ensuring stable performance in humid or wet environments.
(6).Improved Drillability: Rogers' advanced filler system enhances drillability, reducing manufacturing costs compared to standard high-thermal-conductivity laminates that use alumina fillers.
2.Benefits
- High Thermal conductivity
- Improved dielectric heat dissipation enables lower operating temperatures for high power applications
- Excellent high frequency performance
- Lower insertion loss and excellent thermal stability of traces
3. PCB Stackup: 2-layer rigid PCB
| Specification | Details |
|---|---|
| Copper Layer 1 | 35 μm |
| RT/duroid 6035HTC | 0.508 mm (20 mil) |
| Copper Layer 2 | 35 μm |
4.PCB Construction details:
- Board dimensions: 67.02mm x 45.7 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/6 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 0.6mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment
5.PCB Statistics:
Components: 14
Total Pads: 41
Thru Hole Pads: 25
Top SMT Pads: 16
Bottom SMT Pads: 0
Vias: 21
Nets: 2
6.Type of artwork supplied: Gerber RS-274-X
7.Accepted standard: IPC-Class-2
8.Availability: worldwide
9.Applications
The RT/duroid 6035HTC PCB is well-suited for a variety of high-power RF and microwave applications, including:
High-Power RF Amplifiers: Ideal for circuits that require efficient heat dissipation and stable performance under high power.
Microwave Amplifiers: Ensures reliable performance in microwave frequency applications.
Power Amplifiers: Delivers efficient power handling and thermal management.
Couplers and Filters:Provides precise signal coupling and filtering in high-frequency systems.
Power Dividers and Combiners: Ensures stable performance in power distribution and combination circuits.
10.Why Choose RT/duroid 6035HTC?
1.Superior Thermal Management: With a thermal conductivity of 1.44 W/m/K, the 6035HTC PCB is designed to handle high-power applications with ease, reducing the risk of overheating.
2.High-Frequency Performance: The low dielectric constant and dissipation factor ensure excellent signal integrity, making it ideal for RF and microwave applications.
3.Cost-Effective Manufacturing: The improved drillability of the material reduces manufacturing costs, making it a cost-effective choice for high-volume production.
4.Global Availability: Ready to ship worldwide, ensuring timely delivery for your projects.
11.Conclusion
The Rogers RT/duroid 6035HTC High-Frequency PCB is a high-performance material designed to meet the demands of modern high-power RF and microwave applications. With its high thermal conductivity, low dielectric constant, and excellent thermal stability, it is an ideal choice for engineers working on power amplifiers, RF systems, and other high-frequency circuits.
Whether you're designing for high-power RF amplifiers, microwave systems, or power combiners, the RT/duroid 6035HTC PCB offers the reliability and performance you need to bring your projects to life.